he ESDA technology roadmap is written to support and guide the daily work of ESD and latch-up experts in the worldwide industry and academia. At the same time, it is intended to provide a glimpse into the future ESD thresholds of semiconductor devices and their impact on ESD control practices. It also presents current and future technical challenges in ESD and latch-up. With their expertise vision, the ESDA Advanced Topics Team has completed the most recent edition, published in January 2024 [1]. In this article, we want to highlight some of the changes and look at one key trend in advanced packaging.
In this article, we highlighted the ESD target levels and focused on one major trend in our industry. The work on the roadmap will continue. The next edition is already in the works and will be published by the next EOS/ESD Symposium in September 2024.
- https://www.esda.org/standards
- C. Duvvury and A. Righter, “Evolution of Charged Device Model ESD Target Requirements,” In Compliance Magazine, February 26, 2021.
- Dina Medhat et al., “A Programmable Checker for Automated 2.5-D/3-D IC ESD Verification,” 2021 IEEE Transactions on Components, Packaging, and Manufacturing Technology.
- White Paper 2: A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces, 2023.