nyone involved in the development of high-tech products should understand the consequences brought about by such items as component die-shrinks, lower voltage levels, faster rise/fall times, higher switching speeds, etc. These elements often mean more diligence and thoughtful attention to detail is required in laying out circuits today, more so than they ever have been in the past. These extra precautions are required to ensure proper circuit functionality and to meet timing, signal integrity and electromagnetic compatibility (EMC) requirements, to name a few.
Have you ever done everything you could to ensure that your design met all the necessary requirements before building an actual prototype, only to discover issues once you had the functioning hardware in hand? These issues could be related to functionality, signal integrity, EMC, or something else, and they could prevent your design from being released to production on time. If you don’t have a way to quickly troubleshoot these high-speed or high frequency issues within your design, you will be left with guessing what could be wrong. You may make changes based on engineering judgment and intuition, but you will likely have to repeat the process until a solution is found.
It’s easy to see that the trial-and-error approach of guessing what is wrong with your design is flawed and consumes a lot of time and resources. Furthermore, upper management may not be pleased if a solution isn’t found quickly enough. To escape this seemingly endless and frustrating cycle, you must be resourceful and use high frequency probing and measurement techniques to gather actual measured data. You’ll need certain knowledge and tools to develop this skill, which will be discussed shortly. But first, let me clarify what I mean when I say “be scrappy.”
For a current probe, a null measurement has the same purpose as a voltage probe, except it is conducted a little differently. To conduct a null measurement on a current probe, loop the wire to be measured so that it bends back on itself. Where the wire bends, it should sit flush from the opposite side of the probe body and not go all the way through it. As with the voltage probe, the amount of voltage picked up is the margin of error in the actual measurements you will perform when using this probe to collect data.
- Smith, D.C., High Frequency Measurements and Noise in Electronic Circuits, 3rd Edition, Springer, 1993.