Build Your Own ESD Target
Build Your Own ESD Target
solid-state amplifiers
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Under an Order issued by the FCC, non‑compliant voice service providers (185!) have been removed from the Commission’s Robocall Mitigation Database (RMD) by the FCC’s Enforcement Bureau. The RMD was established by the FCC in 2020 to help promote transparency regarding the compliance of voice service providers with Commission rules intended to reduce illegal robocalls made to consumers…
According to a news item posted to the website of the Regulatory Affairs Professional Society (RAPS), the FDA recently sent warning letters to three different medical device companies. In at least one case, a company was cited for promoting the use of its devices to treat medical issues that are outside the scope of the device’s authorization…
attery cells constantly change in form factor, capacity, chemistry, and application. And new types enter the market daily. However, all this traction is not changing one thing: the need for battery cells to be tested to ensure safety, performance, quality, and reliability.
Once a battery has passed its early development stages with an open structure, it becomes a closed one, limiting the possibilities of examining the different layers and components in a non-disruptive way. This makes it harder to gain insight into the battery. But different tests can help to get a deeper understanding of the battery’s structure and behavior without destroying it.
In this overview, we will cover one powerful method, electrochemical impedance spectroscopy (EIS).
he shift from internal combustion engine (ICE) automobiles to electric vehicles (EVs) has come with an array of new subsystems and components that introduce new EMC considerations. The level of complexity involved in automotive electromagnetic compatibility (EMC) testing increases with dynamic driving conditions, where manufacturers not only have to refer to the framework standards offered but must also improvise and establish new internal standards to ensure the vehicle and its internal components all function properly under all driving conditions. A number of challenges may arise when building a suitable test bench that thoroughly tests EVs and electrical components.
This article discusses the importance of EMC testing in the automotive industry, as well as dynamic EMC test systems and their inherent challenges. It also describes the development of a unified EMC test platform for dynamic driving conditions.
ur internal EMC laboratory had decided to verify (not certify, as it’s not an accredited lab) all the equipment we use for pre-compliance EMC tests. The goal was to find some defective equipment and to repair or replace it to avoid the possibility of generating inaccurate test results.
One of the trickiest pieces of equipment to verify was the ESD gun because specialized equipment is needed for the verification test. Off-the-shelf ESD targets are relatively expensive (>1500 USD), so we decided to build a do-it-yourself (DIY) version. (See our final design in Figure 1 and Figure 2.)
The requirement for the maximum tested ESD voltage was set at 15 kV. The voltage divider was made by simply placing 100 MΩ and 1 MΩ high voltage resistors in series (HVR3700001004FR500 and HVA12FA50M0). We used two 50 MΩ in series to increase the voltage rating of the resistors we used. A single 50 MΩ resistor withstands a maximum voltage of 8 kV. So, with two in series, our device could withstand a maximum voltage of 16 kV. Three test points were placed so that connections with the ESD gun and multimeter would be easier to make.
We constructed our ESD target by finding a connector with enough distance between the center pin and the outer pins to fit eight 16.5 Ω 0805 SMD resistors connected in parallel (ERJ‑P06F16R5), which defines the <2.1 Ω input impedance at DC, consistent with the IEC 61000-4-2 standard. 2.0625 Ω is the equivalent input impedance of the eight 16.5 Ω selected resistors placed in parallel, which satisfied the criteria in the standard of under 2.1 Ω.
Resistors were chosen as they have the maximum voltage of 400 V. Maximum voltage during the ESD event would be 15 kV (max voltage requirement)/(330 Ω (output impedance of the ESD gun)/2.1 Ω (impedance of the ESD target)) = 96 V. The maximum voltage can reach a slightly higher value (due to a parasitic capacitance in the ESD gun) that is in parallel to the 330 Ω resistor, which allows for higher current. The ESD target resistor’s datasheet also specifies resistance to 3 kV ESD pulses.
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Guide
In this special issue, we highlight seven product categories—and offer guidance on choosing and using the right products and services for your applications.
“The Practical Engineer”
adio Frequency (RF) absorbing materials play a crucial role in mitigating interference and enhancing the performance of electronic devices. As technology advances, the demand for more efficient and sustainable RF absorbing materials continues to grow. This article explores the latest trends and innovations in RF absorbing materials, focusing on advancements in material science, sustainability, and their impact on Electromagnetic Compatibility (EMC) and compliance engineering.
n the realm of radio frequency (RF) electronics, amplifiers play a pivotal role in enhancing signal strength and maintaining the integrity of transmitted data. This article delves into four critical parameters—gain, noise figure, linearity, and efficiency—providing insights into their significance and how they shape RF amplifier performance.
n the world of electromagnetic compatibility (EMC) compliance, ensuring that electronic devices meet regulatory standards is paramount. A key component in achieving this compliance is the use of antennas, which are essential for testing and measuring electromagnetic emissions and susceptibility. This article explores the role of antennas in compliance testing, focusing on their construction and materials, setup and calibration, and maintenance and care. By understanding these critical aspects, engineers and technicians can ensure accurate and reliable measurements, ultimately leading to devices that perform optimally and comply with stringent regulatory requirements.
lectromagnetic compatibility (EMC) test chambers are critical facilities where electronic devices are tested for their ability to function properly without emitting or being affected by electromagnetic interference (EMI). Designing an EMC test chamber requires careful consideration of several factors to ensure accurate and reliable testing. This article explores the key design considerations for EMC test chambers, focusing on material selection, chamber size, and configuration.
n the world of electronics, ensuring compliance with regulatory standards is paramount to the successful launch and operation of any device. Compliance covers a broad spectrum of requirements, including electromagnetic compatibility (EMC), safety, and environmental considerations. This article delves into the critical design considerations for selecting components, layout and placement on printed circuit boards (PCBs), and effective thermal management, all aimed at achieving compliance.
lectromagnetic interference (EMI) can disrupt the performance and functionality of electronic devices, leading to potential safety hazards and reliability issues. EMI filters are essential components that help mitigate these interferences by blocking unwanted electromagnetic noise. This article delves into real-world applications of EMI filters in consumer electronics, automotive systems, and industrial equipment, highlighting their significance and effectiveness in ensuring smooth and reliable operation.
n the fast-paced world of technology and electronics, ensuring that products meet stringent regulatory standards is critical for market entry and consumer safety. Compliance testing labs play a vital role in this process by verifying that electronic devices adhere to electromagnetic compatibility (EMC), safety, and other regulatory requirements. This article explores the key features and capabilities of compliance testing labs, focusing on accreditation and certification, state-of-the-art equipment, and the expertise and experience of lab personnel.
his is Part 4B of seven devoted to the topic of shielding to prevent electromagnetic wave radiation. The first article [1] discussed reflection and transmission of uniform plane waves at a normal boundary. The second article, [2], addressed the normal incidence of a uniform plane wave on a solid conducting shield with no apertures. The third article, [3], presented the exact solution for the shielding effectiveness of a solid conducting shield. In Part A of the fourth article [4], Version 1 of the approximate solution was derived. In this article, a more practical Version 2 of the approximate solution (obtained from Version 1) is presented.
n the rapidly evolving semiconductor industry, the shift towards Multi-Chip Modules (MCM) and Systems in a Package (SiP) is notable. These advanced assemblies comprise multiple chiplets, sensors, and optoelectronic components, which are vulnerable to Electrostatic Discharge (ESD). The complex internal architecture of MCMs and SiPs—with their internal pins and through-silicon vias—poses challenges for ESD protection in assembly processes.
During the assembly of these systems, components may be exposed to ESD stress. Established methods for assessing the Charged Device Model (CDM) [1] robustness of individual devices exist, including advanced methods such as Capacitively-Coupled Transmission Line Pulsing (CC-TLP) [2]-[7] or low-impedance contact CDM (LICCDM) [8] [9]. While CC-TLP yields reproducible results even for bare dies or wafers, it uses current to determine the robustness level. Insufficient data currently exists regarding the correlation between charging voltages in production machines and discharge currents during the assembly process. This study proposes a method to measure discharge currents during the pick and place process, aiming to link this current to a pre-charge voltage and enhance the evaluation of ESD protection requirements for internal pins.
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